The consortium aims to bolster technology advancements in back-end packaging, an area where US focus has been limited.
UNION CITY, Calif., July 08, 2024 — Resonac Corporation has announced the formation of a new consortium named “US-JOINT,” comprising ten partners, to drive semiconductor back-end process research and development in Silicon Valley. This collaborative effort brings together ten American and Japanese semiconductor materials and equipment companies, including: ; ; ; ; ; ; ; ; ; and Resonac.
US-JOINT expands upon the activities of Japan-based open consortiums led by Resonac (known as “JOINT” and “JOINT2”) into the U.S. market and incorporates five US-based companies. Research and development for US-JOINT will take place at a newly established R&D center in Union City, Calif., funded through joint investment by consortium members. Construction of cleanrooms and equipment installation will commence this year, with full operational capacity expected in 2025.
Mr. Rahm Emanuel, the U.S. Ambassador to Japan, stated, “Semiconductors are now integral to virtually every aspect of our daily lives. Strengthening supply chains through collaboration with trusted partners in this sector is crucial. This new consortium of leading American and Japanese semiconductor industry companies exemplifies the combined efforts of our two nations to accelerate the development of advanced technologies of global significance.”
US-JOINT operates as an open consortium designed for end-customer collaboration. The consortium will verify the latest requirements for semiconductor packaging of advanced devices and validate new concepts under development. Furthermore, by engaging in co-creation with customers, Resonac and US-JOINT members will gain real-time insights into market needs, expediting the R&D of materials and equipment technologies.
“The rapid expansion of next-generation semiconductors for generative AI and autonomous driving necessitates innovative approaches to advanced packaging technologies, such as 2.5D and 3D1,” said Hidenori Abe, executive director of Electronics Business Headquarters, Resonac. “In recent years, leading semiconductor manufacturers and fabless companies in Silicon Valley, including GAFAM2, have been designing semiconductors in-house and introducing new concepts in back-end packaging. The US-JOINT consortium is poised to make significant contributions in this area through our leading materials and equipment technology, now available on-shore in the U.S.”
Advanced packaging and back-end processing of semiconductors have historically been predominantly concentrated in Asia. By bringing packaging R&D closer to major semiconductor device makers in Silicon Valley, this initiative will facilitate further advancements in the technology and address technical challenges, particularly in areas that have received limited attention from other US consortiums, such as advancements in the substrate, interposer, and package fabrication.
Jan Vardaman, president, TechSearch International, Inc., remarked, “This presents a remarkable opportunity for US companies to leverage the expertise gathered in materials and equipment for advanced packaging development.”
For detailed information, please visit the Resonac Holdings Corporation website: .
12.5D packaging refers to a technology that enables the parallel placement of semiconductor chips on the interposer. 3D packaging involves the lamination of chips with TSV (through silicon via).
2GAFAM stands for Google, Apple, Facebook, Amazon, Microsoft.
About the Resonac Group
The Resonac Group was established in January 2023 through the integration of the Showa Denko Group and the Showa Denko Materials Group (formerly Hitachi Chemical Group). The Group’s annual semiconductor and electronic materials sales reach approximately 340 billion yen. The Group is recognized for its extensive lineup of semiconductor materials for back-end processes, boasting a global top market share. The integration of the two companies has empowered the Resonac Group to conduct in-house material design and development, encompassing raw materials to finished goods. The new trade name “RESONAC” was crafted by combining the word “RESONATE” with “C” from the first letter of CHEMISTRY. The Resonac Group actively leverages its co-creative platform to accelerate technological innovation in collaboration with semiconductor manufacturers, materials manufacturers, and equipment manufacturers both in Japan and globally.
For additional information, contact:
Media Relations Group, Brand Communication Department (Phone: 81-3-6263-8002)
Resonac Holdings Corporation
US Agency
Kiterocket
Sandy Fewkes, Senior PR Manager
408-529-9685
